Title :
WASPP Program: advanced passivation for advanced packages and harsh environments
Author :
Reusnow, C. ; Wheelock, S.
Author_Institution :
Lockheed Martin, Dallas, TX
Abstract :
Military electronic parts are becoming unavailable and military systems are forced to use commercial plastic encapsulated microcircuits (PEMs). PEMs are susceptible to moisture related failure mechanisms occurring from long-term exposure, even at very low humidity levels. Some military systems must operate reliably after 30 years in storage. This presentation covers the latest results of an Army Aviation and Missile Command program to provide near hermetic wafer level sealed devices that also benefits the semiconductor industry. The process shows promise for advanced small-scale packages with little plastic protection that must operate in harsh industrial, automotive, or telecommunications environments. The presentation includes the latest developments of the program, including enabling solutions for “popcorning” and the potential for significant speed improvements in compound semiconductor devices
Keywords :
automotive electronics; encapsulation; environmental degradation; integrated circuit packaging; integrated circuit reliability; military equipment; military systems; moisture; passivation; plastic packaging; protection; seals (stoppers); telecommunication equipment; thermal stress cracking; Army Aviation and Missile Command program; PEMs; WASPP Program; Wafer Applied Seal for PEM Protection Project; compound semiconductor devices; device speed; harsh automotive environments; harsh environments; harsh industrial environments; harsh telecommunications environments; humidity level; long-term exposure; military electronic parts; military systems; moisture related failure mechanisms; near-hermetic wafer level sealed devices; packages; passivation; plastic encapsulated microcircuits; plastic protection; popcorning; reliable operation; semiconductor industry; small-scale packages; Electronics industry; Electronics packaging; Failure analysis; Humidity; Missiles; Moisture; Passivation; Plastic packaging; Semiconductor device packaging; Wafer scale integration;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916550
