Title :
Rapid laser-beam reflowing of Pb-free solder foils
Author :
Herbert, Fritz ; Dorn, Lutz ; Shrestha, Shiva
Author_Institution :
Tech. Univ. Berlin, Germany
Abstract :
Different demands are claimed concerning the mechanical, thermal, and electrical characteristics of solders and soldered joints. This is due to new operation fields together with processing temperatures up to 200°C. New development and analysis of Pb-free solders with a widespread melting range complies with acute requirements to ensure higher strength and fatigue stability as well as better wetting performance. The aim of the laser-beam processing experiments was to extend the quality of micro soldered joints and metallization systems through grain refining by rapid laser-beam reflow of innovative Pb-free solders. The experimental tests included the structure of the reflowed solder foil, the shear strength and specific diffusion phenomena of soldered joints
Keywords :
diffusion; environmental factors; fatigue; foils; grain refinement; laser materials processing; melting point; metallisation; packaging; printed circuit manufacture; printed circuit testing; reflow soldering; shear strength; wetting; 200 C; Pb; Pb-free solder foils; Pb-free solders; diffusion phenomena; electrical characteristics; grain refining; laser-beam processing; mechanical characteristics; melting range; metallization systems; micro soldered joint quality; processing temperatures; rapid laser-beam reflow; reflowed solder foil structure; shear strength; solder fatigue stability; solder strength; soldered joints; solders; thermal characteristics; wetting performance; Copper; Crystallization; Grain size; Laser beams; Lead; Optical materials; Optical pulses; Pulsed laser deposition; Soldering; Surface morphology;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916564
