• DocumentCode
    1744478
  • Title

    Photosensitive polynorbornene as a dielectric material for packaging applications

  • Author

    Bai, Yiqun ; Chiniwalla, Punit ; Kohl, Paul A. ; Bidstrup-Allen, Sue Ann

  • Author_Institution
    Sch. of Chem. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    322
  • Lastpage
    326
  • Abstract
    The rapid development of the microelectronics industry creates high demand for low dielectric constant (low-k) materials. Polynorbornene (AvatrelTM) is a new photodefinable dielectric material developed by the BF Goodrich Company. A type of cationic photoinitiator, onium salts, is used to initiate the crosslinking reaction of epoxide groups. The reaction mechanism of poly(decylnorbornene-co-epoxidenorbornene) was studied. The structure/properties relationships of the polymer film were investigated. Copolymer composition and process conditions affect the properties of the polymer film. A lower epoxidenorbornene content results in lower dielectric constant, lower residual stress, better adhesion, and good photodefinition, but poor multilayer capability. Lower exposure dose, lower post bake temperature and shorter post bake time improve photodefinition
  • Keywords
    adhesion; dielectric thin films; heat treatment; integrated circuit packaging; internal stresses; permittivity; photolithography; polymer films; Avatrel; adhesion; cationic photoinitiator; copolymer composition; copolymer process conditions; crosslinking reaction; dielectric constant; dielectric material; epoxide groups; epoxidenorbornene content; exposure dose; low dielectric constant materials; low-k materials; microelectronics industry; multilayer capability; onium salts; packaging applications; photodefinable dielectric material; photodefinition; photosensitive polynorbornene; poly(decylnorbornene-co-epoxidenorbornene); polymer film properties; polymer film structure; polynorbornene; post bake temperature; post bake time; reaction mechanism; residual stress; Adhesives; Delay; Dielectric constant; Dielectric materials; Mechanical factors; Microelectronics; Nonhomogeneous media; Packaging; Polymer films; Residual stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916596
  • Filename
    916596