DocumentCode
1744478
Title
Photosensitive polynorbornene as a dielectric material for packaging applications
Author
Bai, Yiqun ; Chiniwalla, Punit ; Kohl, Paul A. ; Bidstrup-Allen, Sue Ann
Author_Institution
Sch. of Chem. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2001
fDate
2001
Firstpage
322
Lastpage
326
Abstract
The rapid development of the microelectronics industry creates high demand for low dielectric constant (low-k) materials. Polynorbornene (AvatrelTM) is a new photodefinable dielectric material developed by the BF Goodrich Company. A type of cationic photoinitiator, onium salts, is used to initiate the crosslinking reaction of epoxide groups. The reaction mechanism of poly(decylnorbornene-co-epoxidenorbornene) was studied. The structure/properties relationships of the polymer film were investigated. Copolymer composition and process conditions affect the properties of the polymer film. A lower epoxidenorbornene content results in lower dielectric constant, lower residual stress, better adhesion, and good photodefinition, but poor multilayer capability. Lower exposure dose, lower post bake temperature and shorter post bake time improve photodefinition
Keywords
adhesion; dielectric thin films; heat treatment; integrated circuit packaging; internal stresses; permittivity; photolithography; polymer films; Avatrel; adhesion; cationic photoinitiator; copolymer composition; copolymer process conditions; crosslinking reaction; dielectric constant; dielectric material; epoxide groups; epoxidenorbornene content; exposure dose; low dielectric constant materials; low-k materials; microelectronics industry; multilayer capability; onium salts; packaging applications; photodefinable dielectric material; photodefinition; photosensitive polynorbornene; poly(decylnorbornene-co-epoxidenorbornene); polymer film properties; polymer film structure; polynorbornene; post bake temperature; post bake time; reaction mechanism; residual stress; Adhesives; Delay; Dielectric constant; Dielectric materials; Mechanical factors; Microelectronics; Nonhomogeneous media; Packaging; Polymer films; Residual stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-64-5
Type
conf
DOI
10.1109/ISAOM.2001.916596
Filename
916596
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