Quality improvement through SPC/DOE in SMT manufacturing

Author

Zhen, He ; Ershi, Qi ; Zixian, Liu

Author_Institution

Sch. of Manage., Tianjin Univ., China

Volume

2

fYear

2000

fDate

2000

Firstpage

855

Abstract

The paper addresses how to analyze and improve process quality in surface mount technology (SMT) manufacturing using multi-vari analysis (MVA), measurement system analysis (MSA), and design of experiment (DOE). The key process parameter (solder paste height) in the printing process has been optimized and defects caused by poor soldering have been reduced. The paper provides a good solution for increasing solderability of surface mount technology manufacturing through joint use of statistical process control (SPC) and DOE

Keywords

design of experiments; quality control; soldering; statistical process control; surface mount technology; SMT manufacturing; design of experiment; measurement system analysis; multi-vari analysis; poor soldering defects reduction; printing process; process parameter; process quality improvement; solder paste height; solderability; statistical process control; surface mount technology; Analysis of variance; Helium; Instruments; Manufacturing processes; Printing; Process control; Pulp manufacturing; Quality management; Surface-mount technology; US Department of Energy;

fLanguage

English

Publisher

ieee

Conference_Titel

Management of Innovation and Technology, 2000. ICMIT 2000. Proceedings of the 2000 IEEE International Conference on

Print_ISBN

0-7803-6652-2

Type

conf

DOI

10.1109/ICMIT.2000.916817

Filename

916817