DocumentCode :
1745394
Title :
Direct bonding of piezoelectric materials and its applications
Author :
Eda, Kazuo ; Onishi, Keiji ; Sato, Hiroki ; Taguchi, Yutaka ; Tomita, Masahiro
Author_Institution :
Nakao Lab., Matsushita Electr. Ind. Co. Ltd., Moriguchi, Japan
Volume :
1
fYear :
2000
fDate :
36800
Firstpage :
299
Abstract :
The needs for piezoelectric devices such as SAW filters has been greatly increasing with the rapid growth of mobile communication systems. The requirements for the devices have been widely spreading and becoming more critical. In order to satisfy these requirements not only new designing methods but also new piezoelectric materials have to be brought into practice. New technique of direct bonding of piezoelectric materials is very promising to give us new piezoelectric characteristics. The direct bonding can be carried out by contacting the hydrated surfaces of the piezoelectric materials and by heat-treating at relatively low temperatures. Authors found that the direct bonding can be applied to wide variety of materials such as quartz, LiNbO3, LiTaO3, PLZT, Si, glass and so on. Some combinations of them showed new preferable piezoelectric characteristics. In this paper the possibility of the direct bonding of piezoelectric materials and its applications such as SAW filters are discussed
Keywords :
piezoelectric materials; surface acoustic wave filters; wafer bonding; LiNbO3; LiTaO3; PLZT; PbLaZrO3TiO3; SAW filter; Si; SiO2; direct bonding; glass; heat treatment; mobile communication system; piezoelectric device; piezoelectric material; quartz; surface hydration; Bandwidth; Bonding; Crystalline materials; Crystallization; Mobile communication; Packaging; Piezoelectric devices; Piezoelectric films; Piezoelectric materials; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2000 IEEE
Conference_Location :
San Juan
ISSN :
1051-0117
Print_ISBN :
0-7803-6365-5
Type :
conf
DOI :
10.1109/ULTSYM.2000.922560
Filename :
922560
Link To Document :
بازگشت