A study of miniaturization technique of SAW antenna duplexer for mobile application

This paper describes the miniaturization techniques for surface acoustic wave antenna duplexers. Previous duplexer design consisted of two filters, one transmitter, one receiver, and matching circuit enclosed in one package. For package miniaturization, it is necessary to change the design of the structure. This includes the matching circuit, since it is designed on the surface of the package. Replacing previous tungsten material, the new matching circuit is achieved by a copper stripline embedded within the package. Package material also changes from aluminum oxide ceramics to glass ceramics. As for filter chip, transmitter and receiver filter are combined into one chip. A single layer of aluminum magnesium was examined, in order to provide better power durability