DocumentCode :
174586
Title :
Leveling to the last mile: Near-zero-cost bit level wear leveling for PCM-based main memory
Author :
Mengying Zhao ; Liang Shi ; Chengmo Yang ; Xue, Chun Jason
Author_Institution :
Dept. of Comput. Sci., City Univ. of Hong Kong, Hong Kong, China
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
16
Lastpage :
21
Abstract :
Phase change memory (PCM) has demonstrated great potential as an alternative of DRAM to serve as main memory due to its favorable characteristics of non-volatility, scalability and near-zero leakage power. However, the comparatively poor endurance of PCM largely limits its adoption. Wear leveling strategies targeting to even write distributions have been proposed at different granularities and on various memory hierarchies for PCM endurance enhancement. Write operations are distributed across the memory through migrating data from heavily written locations to less burdened ones, which is usually guided by counters recording the number of writes. However, evenly distributing writes at a coarse granularity cannot deliver the best endurance results as write distributions are highly imbalanced even at the bit level. In this work, we propose a near-zero-cost bit-level wear leveling strategy to improve PCM endurance. The proposed technique can be combined with various coarse-grained wear leveling strategies. Experiment results show 102% endurance enhancement on average, which is 34% higher than the most related work, with significantly lower storage, performance and energy overheads.
Keywords :
DRAM chips; phase change memories; DRAM; PCM based main memory; PCM endurance enhancement; energy overhead; memory hierarchy; near-zero leakage power; near-zero-cost bit-level wear leveling strategy; phase change memory; write distributions; Benchmark testing; Educational institutions; Phase change materials; Radiation detectors; Random access memory; Registers; Round robin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design (ICCD), 2014 32nd IEEE International Conference on
Conference_Location :
Seoul
Type :
conf
DOI :
10.1109/ICCD.2014.6974656
Filename :
6974656
Link To Document :
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