DocumentCode
1746069
Title
Flip chip bonded optoelectronic devices on ultra-thin silicon-on-sapphire
Author
Kuznia, C.B. ; Albares, D.J. ; Wong, M. ; Pendleton, M. ; Green, J. ; Cable, J. ; Athale, R. ; Reedy, R.E.
Author_Institution
Peregrine Semicond. Corp, San Diego, CA, USA
Volume
2
fYear
2001
fDate
17-22 March 2001
Abstract
We describe flip chip bonding of arrayed optoelectronic devices (VCSELs, MSM and PIN detectors) onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 2.5 Gbps (and higher) parallel optical links.
Keywords
flip-chip devices; integrated optoelectronics; metal-semiconductor-metal structures; optical receivers; optical transmitters; p-i-n photodiodes; photodetectors; sapphire; semiconductor lasers; silicon; silicon-on-insulator; surface emitting lasers; MSM detectors; PIN detectors; Si-Al/sub 2/O/sub 3/:Ti; VCSELs; arrayed optoelectronic devices; flip chip bonded optoelectronic devices; flip chip bonding; optical receivers; optical transmitters; parallel optical links; ultra-thin silicon-on-sapphire; Bonding; Circuits; Costs; EPROM; Flip chip; Optical receivers; Optical transmitters; Optoelectronic devices; Packaging; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exhibit, 2001. OFC 2001
Conference_Location
Anaheim, CA, USA
Print_ISBN
1-55752-655-9
Type
conf
Filename
927383
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