DocumentCode
174611
Title
An optimized diagnostic procedure for pre-bond TSV defects
Author
Bei Zhang ; Agrawal, Vishwani D.
Author_Institution
Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
189
Lastpage
194
Abstract
Based on a recent pre-bond TSV probing technique, this paper proposes an iterative greedy procedure to sort the order of test sessions for reducing pre-bond TSV test time. We then combine that session sorting procedure with two existing methods to develop a 3-Step test time Optimization Simulator named “SOS3”. SOS3 consists of an ILP (integer linear programming) model for session generation, the greedy procedure for session sorting, and a TSV identification algorithm for early test termination. Experiments are done for various TSV networks and two observations are made. First, session sorting plays an important role within SOS3 as it helps to further reduce pre-bond test time expectation and thus reduces pre-bond TSV test cost. Second, SOS3 as a framework greatly speeds up the pre-bond TSV test.
Keywords
greedy algorithms; integer programming; integrated circuit testing; linear programming; three-dimensional integrated circuits; TSV identification algorithm; early test termination; integer linear programming; iterative greedy procedure; optimization simulator; optimized diagnostic procedure; prebond TSV defects; prebond TSV test time; session generation; session sorting; Circuit faults; Fault diagnosis; Needles; Probes; Sorting; Testing; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design (ICCD), 2014 32nd IEEE International Conference on
Conference_Location
Seoul
Type
conf
DOI
10.1109/ICCD.2014.6974680
Filename
6974680
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