• DocumentCode
    174611
  • Title

    An optimized diagnostic procedure for pre-bond TSV defects

  • Author

    Bei Zhang ; Agrawal, Vishwani D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    189
  • Lastpage
    194
  • Abstract
    Based on a recent pre-bond TSV probing technique, this paper proposes an iterative greedy procedure to sort the order of test sessions for reducing pre-bond TSV test time. We then combine that session sorting procedure with two existing methods to develop a 3-Step test time Optimization Simulator named “SOS3”. SOS3 consists of an ILP (integer linear programming) model for session generation, the greedy procedure for session sorting, and a TSV identification algorithm for early test termination. Experiments are done for various TSV networks and two observations are made. First, session sorting plays an important role within SOS3 as it helps to further reduce pre-bond test time expectation and thus reduces pre-bond TSV test cost. Second, SOS3 as a framework greatly speeds up the pre-bond TSV test.
  • Keywords
    greedy algorithms; integer programming; integrated circuit testing; linear programming; three-dimensional integrated circuits; TSV identification algorithm; early test termination; integer linear programming; iterative greedy procedure; optimization simulator; optimized diagnostic procedure; prebond TSV defects; prebond TSV test time; session generation; session sorting; Circuit faults; Fault diagnosis; Needles; Probes; Sorting; Testing; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2014 32nd IEEE International Conference on
  • Conference_Location
    Seoul
  • Type

    conf

  • DOI
    10.1109/ICCD.2014.6974680
  • Filename
    6974680