Title :
Reliability tests for thermal aging of thin-film AlCu metallizations
Author :
Catelani, M. ; Nicoletti, R.
Author_Institution :
Dipartimento di Elettronica e Telecommun., Florence Univ., Italy
Abstract :
The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an automatic measurement system, previously designed and implemented Reliability tests have been performed at 150°C and 220°C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible
Keywords :
ageing; aluminium alloys; automatic testing; copper alloys; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; metallic thin films; 150 C; 220 C; AlCu; degradation process; reliability tests; test structures; thermal aging; thermal stress; thin-film AlCu metallizations; Aging; Circuit testing; Integrated circuit reliability; Metallization; Performance evaluation; Telecommunications; Temperature sensors; Thermal degradation; Thermal stresses; Transistors;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2001. IMTC 2001. Proceedings of the 18th IEEE
Conference_Location :
Budapest
Print_ISBN :
0-7803-6646-8
DOI :
10.1109/IMTC.2001.928198
