DocumentCode
174668
Title
Variation-aware joint optimization of the supply voltage and sleep transistor size for the 7nm FinFET technology
Author
Qing Xie ; Yanzhi Wang ; Shuang Chen ; Pedram, M.
Author_Institution
Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
380
Lastpage
385
Abstract
Power gating is a very effective method in reducing the leakage energy during the standby mode in VLSI circuits at the cost of increased circuit delay. This method has been well studied and widely used for circuits fabricated by using traditional CMOS technology nodes operating at super-threshold supply voltage regime. However, for advanced technology nodes with small feature sizes and low supply voltages, the propagation delay becomes very sensitive to the high process-induced variations. Therefore, this paper first analyzes how the circuit delay depends on the size of the sleep transistor under the process-induced variation for the 7nm gate length FinFET technology. Then a joint optimization problem is formulated to minimize the total energy consumption, while both supply voltage and sleep transistor size are considered as optimization variables. A near-optimal heuristic is presented to solve the optimization problem and determine the energy-optimal supply voltage and sleep transistor size. Experimental results based on HSPICE simulations show that more than 98% energy reduction for applications with relaxed deadline constraints after applying the joint optimization technique, compared to FinFET circuits without using the power gating method.
Keywords
CMOS integrated circuits; MOSFET; energy consumption; variational techniques; CMOS technology nodes; FinFET technology; VLSI circuits; circuit delay; energy-optimal supply voltage; joint optimization problem; leakage energy; near-optimal heuristic; power gating; process-induced variations; propagation delay; relaxed deadline constraints; size 7 nm; sleep transistor size; standby mode; super-threshold supply voltage regime; total energy consumption; Delays; Energy consumption; FinFETs; Optimization; Switching circuits; FinFETs; line-edge roughness; power gating; process-induced variation; sleep transistor sizing; voltage scaling;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design (ICCD), 2014 32nd IEEE International Conference on
Conference_Location
Seoul
Type
conf
DOI
10.1109/ICCD.2014.6974709
Filename
6974709
Link To Document