• DocumentCode
    174668
  • Title

    Variation-aware joint optimization of the supply voltage and sleep transistor size for the 7nm FinFET technology

  • Author

    Qing Xie ; Yanzhi Wang ; Shuang Chen ; Pedram, M.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    380
  • Lastpage
    385
  • Abstract
    Power gating is a very effective method in reducing the leakage energy during the standby mode in VLSI circuits at the cost of increased circuit delay. This method has been well studied and widely used for circuits fabricated by using traditional CMOS technology nodes operating at super-threshold supply voltage regime. However, for advanced technology nodes with small feature sizes and low supply voltages, the propagation delay becomes very sensitive to the high process-induced variations. Therefore, this paper first analyzes how the circuit delay depends on the size of the sleep transistor under the process-induced variation for the 7nm gate length FinFET technology. Then a joint optimization problem is formulated to minimize the total energy consumption, while both supply voltage and sleep transistor size are considered as optimization variables. A near-optimal heuristic is presented to solve the optimization problem and determine the energy-optimal supply voltage and sleep transistor size. Experimental results based on HSPICE simulations show that more than 98% energy reduction for applications with relaxed deadline constraints after applying the joint optimization technique, compared to FinFET circuits without using the power gating method.
  • Keywords
    CMOS integrated circuits; MOSFET; energy consumption; variational techniques; CMOS technology nodes; FinFET technology; VLSI circuits; circuit delay; energy-optimal supply voltage; joint optimization problem; leakage energy; near-optimal heuristic; power gating; process-induced variations; propagation delay; relaxed deadline constraints; size 7 nm; sleep transistor size; standby mode; super-threshold supply voltage regime; total energy consumption; Delays; Energy consumption; FinFETs; Optimization; Switching circuits; FinFETs; line-edge roughness; power gating; process-induced variation; sleep transistor sizing; voltage scaling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2014 32nd IEEE International Conference on
  • Conference_Location
    Seoul
  • Type

    conf

  • DOI
    10.1109/ICCD.2014.6974709
  • Filename
    6974709