• DocumentCode
    1746893
  • Title

    An investigation of thick-film resistor, fired at different temperatures, for strain sensors

  • Author

    Hrovat, Mako ; Belavic, Darko ; Samardzija, Zoran ; Holc, Janez

  • Author_Institution
    Jozef Stefan Inst., Ljubljana, Slovenia
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    Some commercial 10 kΩ/sq. thick-film resistors based on RuO 2, ruthenates or a mixture of RuO2 and ruthenates, were evaluated for strain gauge applications. The resistors were fired at different temperatures to determine the influence of firing temperature on the electrical characteristics. The conductive phase in the resistors was determined with X-ray powder-diffraction (XRD) analysis. Microstructures of the thick-film resistors were analysed via SEM and EDS. The temperature coefficients of resistivity, noise indices and gauge factors (GFs) were measured. The results indicate that both the GFs and the noise indices are different for resistors with the same nominal sheet resistivity but which came from different resistor series
  • Keywords
    X-ray chemical analysis; X-ray diffraction; electric sensing devices; electron device noise; ruthenium compounds; scanning electron microscopy; strain sensors; thick film resistors; Bi2Ru2O7; EDS; Pb2Ru2O6.5; RuO2; RuO2-based resistors; RuO2/ruthenates mixture-based resistors; SEM; X-ray powder-diffraction analysis; conductive phase; electrical characteristics; firing temperature; firing temperatures; gauge factors; noise indices; resistor firing temperatures; resistor series; ruthenates-based resistors; sheet resistivity; strain gauge applications; strain sensors; temperature coefficient of resistivity; thick-film resistor; thick-film resistor microstructures; Bismuth; Capacitive sensors; Conductivity; Glass; Microstructure; Noise measurement; Resistors; Semiconductor device noise; Temperature sensors; Thick film sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
  • Conference_Location
    Calimanesti-Caciulata
  • Print_ISBN
    0-7803-7111-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2001.931004
  • Filename
    931004