Title :
Using neural networks with a linear output neuron to model plasma etch processes
Author :
Kim, Byungwhan ; Choi, Wookyung ; Kim, Hyegun
Author_Institution :
Dept. of Electron. Eng., Sejong Univ., Seoul, South Korea
Abstract :
A backpropagation neural network (BPNN) has been applied to model various plasma processes. As a neuron activation function, the BPNN typically uses either a bipolar or unipolar sigmoid function in both hidden and output layers. In this study, a BPNN with a linear function in the output layer and a bipolar sigmoid function in the hidden layer is introduced and applied to model a plasma etch process. The gradients related to the functions were experimentally optimized. The BPNN with a linear function in the output layer demonstrated an improved prediction over the BPNNs with other function combinations. By optimizing the gradients, its prediction accuracy was further significantly increased as compared to nonoptimized models. The process modeled is a magnetically enhanced reactive ion etch (MERIE) process and etch responses modeled include an etch rate, Al(Si) selectivity to photoresist, anisotropy and bias in critical dimension. The process was characterized by a 26$fractional factorial experiment
Keywords :
backpropagation; control system analysis; etching; integrated circuit manufacture; neurocontrollers; plasma materials processing; process control; 26- fractional factorial experiment; Al(Si) selectivity to photoresist; anisotropy; bipolar sigmoid function; critical dimension bias; etch rate; etch responses; hidden layer; linear function; linear output neuron; magnetically enhanced reactive ion etch process; neural networks; neuron activation function; output layer; plasma etch processes modelling; prediction accuracy; prediction performance; Accuracy; Backpropagation; Etching; Magnetic anisotropy; Neural networks; Neurons; Perpendicular magnetic anisotropy; Plasma applications; Predictive models; Resists;
Conference_Titel :
Industrial Electronics, 2001. Proceedings. ISIE 2001. IEEE International Symposium on
Conference_Location :
Pusan
Print_ISBN :
0-7803-7090-2
DOI :
10.1109/ISIE.2001.931830