• DocumentCode
    1747257
  • Title

    Lateral trench IGBT with effective p+ diverter having superior electrical characteristics for smart power IC

  • Author

    Kang, Ey Goo ; Moon, Seung Hyun ; Sung, Man Young

  • Author_Institution
    Dept. of Electr. Eng., Korea Univ., Seoul, South Korea
  • Volume
    3
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    2059
  • Abstract
    A new lateral trench insulated gate bipolar transistor (LTIGBT) with p+ diverter was proposed to improve the characteristics of the conventional LTIGBT. The p+ divert layer was placed between anode electrode region and cathode electrode. Generally, if the LTIGBT had p+ divert region, forward blocking voltage was decreased greatly because n-drift layer corresponding to punch-through was decreased, However, the forward blocking voltage of the proposed LTIGBT with p+ diverter was 140 V. That of the conventional LTIGBT of the same size was 105 V. The forward blocking voltage of LTIGBT with p+ diverter increased 1.3 times more than those of the conventional LTIGBT. Because the p+ diverter region of the proposed device was an enclosed trench oxide layer, the electric field moved toward trench-oxide layer, and punch through breakdown of LTIGBT with p+ diverter occurred. Therefore, the p+ diverter of the proposed LTIGBT didn´t relate to breakdown voltage in a different way to conventional LTIGBT. The latch-up current densities of the conventional LTIGBT and LTIGBT with p+ diverter were 540A/cm2, and 1453A/cm2, respectively. The enhanced latch-up capability of the LTEIGBT was obtained through holes in the current directly reaching the cathode via the p+ divert region and p+ cathode layer beneath n+ cathode layer
  • Keywords
    anodes; cathodes; insulated gate bipolar transistors; isolation technology; power integrated circuits; 105 V; 140 V; anode electrode region; cathode electrode; electric field; enclosed trench oxide layer; forward blocking voltage; holes; latch-up current densities; lateral trench insulated gate bipolar transistor; n-drift layer; n+ cathode layer; p+ cathode layer; p+ divert layer; p+ diverter; punch-through; smart power IC; trench-oxide layer; Anodes; Cathodes; Charge carrier processes; Current density; Electric variables; Electrodes; Insulated gate bipolar transistors; Numerical simulation; Power integrated circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2001. Proceedings. ISIE 2001. IEEE International Symposium on
  • Conference_Location
    Pusan
  • Print_ISBN
    0-7803-7090-2
  • Type

    conf

  • DOI
    10.1109/ISIE.2001.932032
  • Filename
    932032