Title :
Using conduction modes basis functions for efficient electromagnetic analysis of on-chip and off-chip interconnect
Author :
Daniel, Luca ; Sangiovanni-Vincentelli, Alberto ; White, Jacob
Author_Institution :
California Univ., Berkeley, CA, USA
Abstract :
In this paper, we present an efficient method to model the interior of the conductors in a quasi-static or full-wave integral equation solver. We show how interconnect cross-sectional current distributions can be modeled using a small number of conduction modes as basis functions for the discretization of the mixed potential integral equation (MPIE). Two examples are presented to demonstrate the computational attractiveness of our method. In particular, we show how our new approach can successfully and efficiently capture skin effects, proximity effects and transmission line resonances.
Keywords :
current distribution; integral equations; integrated circuit interconnections; integrated circuit modelling; skin effect; conduction modes; conduction modes basis functions; electromagnetic analysis; full-wave integral equation solver; interconnect cross-sectional current distributions; mixed potential integral equation; off-chip interconnect; on-chip interconnect; proximity effects; quasi-static integral equation solver; skin effects; transmission line resonances; Artificial intelligence; Conductors; Differential equations; Electromagnetic analysis; Frequency; Integral equations; Integrated circuit interconnections; Packaging; Proximity effect; Skin effect;
Conference_Titel :
Design Automation Conference, 2001. Proceedings
Print_ISBN :
1-58113-297-2
DOI :
10.1109/DAC.2001.156203