Title :
Implementation and performance evaluation of TeleMIP
Author :
Chakraborty, Kaushik ; Misra, Archan ; Das, Subir ; McAuley, Anthony ; Dutta, Ashutosh ; Das, Sajal K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
Abstract :
We present our implementation of TeleMIP, a two-level architecture for IP-based mobility management. TeleMIP essentially uses an intra-domain mobility management protocol (IDMP) for managing mobility within a domain, and mobile IP for supporting inter-domain (global) mobility. Unlike other proposed schemes for intra-domain mobility management, IDMP uses two care-of addresses for mobility management. The global care-of address is relatively stable and identifies the mobile node´s current domain, while the local care-of address changes every time the mobile changes subnets and identifies the mobile´s current point of attachment. The paper describes our TeleMIP implementation based on enhancements to the Stanford University mobile IP Linux code and presents performance results obtained through experiments on our test-bed. Finally, we use analysis to accurately quantify the savings in signaling overhead obtained when TeleMIP is used in environments where mobiles change subnets relatively rapidly
Keywords :
cellular radio; network operating systems; radio networks; software agents; telecommunication computing; telecommunication network management; transport protocols; IDMP; IP-based mobility management; Stanford University; TeleMIP; cellular networks; global care-of address; global mobility; intra-domain mobility management protocol; local care-of address; mobile IP; mobile IP Linux code; mobility agent; performance evaluation; performance results; signaling overhead savings; subnets; test-bed; two-level architecture; Computer architecture; Computer science; Educational institutions; Land mobile radio cellular systems; Linux; Mobile radio mobility management; Protocols; Signal analysis; Testing; US Government;
Conference_Titel :
Communications, 2001. ICC 2001. IEEE International Conference on
Conference_Location :
Helsinki
Print_ISBN :
0-7803-7097-1
DOI :
10.1109/ICC.2001.936598