DocumentCode :
1750030
Title :
Maximizing electromechanical properties of PMN materials ultrasonic transducers
Author :
Yoon, C.H. ; Sehirlioglu, A. ; Pilgrim, S.M. ; Bridger, K.
Author_Institution :
New York State Coll. of Ceramics, Alfred Univ., NY, USA
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
427
Abstract :
In an effort to maximize electrostrictive response of PMN materials for transducer applications, a particulate coating process incorporating small amounts (<2 mol %) of chemically derived additives was used. Applying this particulate coating process to commercially available Pb(Mg1/3Nb2/3)O3-PbTiO3 -BaTiO3 (PMN-PTBT) based ceramics, improves both homogeneity and uniformity of grain size. Ceramics with improved and tailored properties for disparate applications can also be synthesized. Several additives such as Ti, Ba, and Zn were selected as promising candidates for improving the dielectric and electromechanical properties of the base PMN-PT-BT based composition. The addition of Ti with Zn nearly doubled the induced strain across most of the reduced temperature (T-Tmax) range-a span of 40°C. This was achieved without increasing the associated hysteresis. The general applicability of this technique is discussed with respect to other PMN-PT and relaxor systems
Keywords :
barium compounds; coating techniques; electrostriction; ferroelectric ceramics; grain size; lead compounds; magnesium compounds; niobium compounds; sol-gel processing; ultrasonic transducers; Pb(Mg1/3Nb2/3)O3-PbTiO3 -BaTiO3; PbMgO3NbO3-PbTiO3-BaTiO3 ; chemically derived additives; electromechanical properties; electrostrictive response; grain size homogeneity; grain size uniformity; hysteresis; induced strain; particulate coating process; ultrasonic transducers; Additives; Ceramics; Chemical processes; Chemical transducers; Coatings; Electrostriction; Grain size; Niobium; Ultrasonic transducers; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on
Conference_Location :
Honolulu, HI
ISSN :
1099-4734
Print_ISBN :
0-7803-5940-2
Type :
conf
DOI :
10.1109/ISAF.2000.941587
Filename :
941587
Link To Document :
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