• DocumentCode
    1751852
  • Title

    Optimization of the thermodynamic characteristics of bolometric film structures

  • Author

    Medvedev, Yu.V. ; Nikolaenko, Yu M. ; Grishin, A.M. ; Khartsev, S.I.

  • Author_Institution
    Donetsk Physico-Technical Inst., Ukraine
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    383
  • Abstract
    The main advances in the film technology of HTSC and manganite containing materials during the last ten years are related to different electrical properties. A few efforts were directed at the investigation of thermodynamics characteristics. As a result the best modem film structures are not optimal for bolometric application. This is clearly seen from the low operating speed of non-cooled manganite bolometers. To improve the characteristics of HTSC bolometers, hybrid constructions in the base of the film structure were designed. However, even in the case of room and higher temperature bolometers this problem can be resolved directly with the help of optimization of the thermal kinetic coefficients of the film structure. The quantitative analysis of this possibility is the purpose of the author´s work
  • Keywords
    bolometers; high-temperature superconductors; microwave detectors; superconducting microwave devices; superconducting thin films; thermal resistance; thermodynamic properties; HTSC bolometers; HTSC film technology; LaAlO3; LaPbSrMnO3-LaAlO3; bolometric film structures; film/substrate interface; high temperature superconductors; hybrid constructions; microwave. power; thermal kinetic coefficients; thermodynamic characteristics optimisation; Bolometers; Electromagnetic heating; Frequency; Hafnium; Kinetic theory; Substrates; Temperature dependence; Temperature sensors; Thermal resistance; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physics and Engineering of Millimeter and Sub-Millimeter Waves, 2001. The Fourth International Kharkov Symposium on
  • Conference_Location
    Kharkov
  • Print_ISBN
    0-7803-6473-2
  • Type

    conf

  • DOI
    10.1109/MSMW.2001.946861
  • Filename
    946861