Title :
A fully integrated 5.9GHz RF frontend in 0.25um GaN-on-SiC for vehicle-to-vehicle applications
Author :
Pilsoon Choi ; Goswami, Suparna ; Chirn Chye Boon ; Li-Shiuan Peh ; Hae-Seung Lee
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
Abstract :
This paper presents the design of a high-efficiency and high-power RF frontend for the 802.11p standard, leveraging an embedded Tx/Rx switching scheme and a dual-bias power amplifier (PA) linearization technique. The fully integrated RF frontend is fabricated in 0.25um GaN-on-SiC technology and occupies 2mm × 1.2mm. In the Tx mode, the PA+Tx switch achieves 48.5% drain efficiency at 33.9dBm Psat with 28V supply. With OFDM-modulated signals, it achieves 30% average efficiency at 27.8dBm output power while meeting the -25dB EVM limit without predistortion. In the Rx mode, the LNA+Rx switch achieves +22dBm OIP3 with 8dB power gain at 12V supply. The fully integrated high-efficiency and linear RF frontend is demonstrated at high output power for vehicular communications for the first time.
Keywords :
CMOS integrated circuits; III-V semiconductors; MMIC power amplifiers; OFDM modulation; field effect MMIC; gallium compounds; linearisation techniques; low noise amplifiers; mobile radio; silicon compounds; wide band gap semiconductors; 802.11p standard; GaN; LNA-Rx switch; OFDM-modulated signals; PA linearization technique; PA-Tx switch; SiC; dual-bias power amplifier; efficiency 48.5 percent; embedded Tx-Rx switching scheme; frequency 5.9 GHz; fully integrated RF frontend; gain 8 dB; high-efficiency RF frontend; high-power RF frontend; size 0.25 mum; vehicle-to-vehicle applications; vehicular communications; voltage 12 V; voltage 28 V; Antennas; Gallium nitride; Linearity; Power amplifiers; Power generation; Radio frequency; Switches; GaN; IEEE 802.11p; LNAs; RF frontend; antenna switches; power amplifiers;
Conference_Titel :
Radio Frequency Integrated Circuits Symposium, 2014 IEEE
Conference_Location :
Tampa, FL
Print_ISBN :
978-1-4799-3862-9
DOI :
10.1109/RFIC.2014.6851751