Title :
CMP oxide slurry recycle system implementation
Author :
Hsu, Jack ; Wann, Y.J. ; Pai, J.R.
Author_Institution :
TSMC (Taiwan Semicond. Manuf. Co.), Hsinchu, Taiwan
Abstract :
This paper demonstrates and realizes that the Chemical Mechanical Polishing (CMP) oxide slurry could be recycled to CMP process again. By the slurry recycling process, 90% waste slurry could be reclaimed and also over 90% wastewater could be recycled and reuse in integrated circuits (ICs) process. The demonstrated reclaimed slurry show compatible removal rate (R/R) and the same uniformity (U%) of R/R. Also the compatible R/R profile and defectives level.
Keywords :
chemical mechanical polishing; integrated circuit manufacture; recycling; slurries; wastewater; CMP oxide slurry recycle system; chemical mechanical polishing; integrated circuits process; waste slurry reclaimation; wastewater recycling; wastewater reuse; Receivers; Slurries;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
