High productivity multiple DUT CV test for MEMS microphone wafer with automatic correction

Productivity in MEMS wafer process is getting more and more important as mass production on 200 mm wafer is increasing. Multiple DUT parallel CV test is a high productive way for MEMS Microphone wafer test process, however, in case of the one of two electrodes is connected to the wafer substrate with some contact resistance, interference among DUTs has an effect on the measurement circuit of tester and makes measurement value inaccurate. This paper describes measurement problems in multiple DUT parallel CV test for such wafer, and proposes a practical method correcting a measurement capacitance automatically to solve the problem.