• DocumentCode
    1753953
  • Title

    Compensation of high-speed drift by Cu-CMP APC in continuous input of high-mix products

  • Author

    Miyashita, N. ; Tamaki, K. ; Tsuchiyama, H. ; Uchida, N. ; Sakai, K. ; Yamamoto, K.

  • Author_Institution
    Hitachi Ltd., Yokohama, Japan
  • fYear
    2010
  • fDate
    18-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a novel Cu-CMP APC that compensates the high-speed drift of thinning amount during the continuous input of high-mix products. Compensation is realized by estimating the polishing rate as the summation of the estimated standard drift and the amount of shift for each product group. A new algorithm in which the products with similar rates are systematically grouped has also been developed. Numerical simulations have demonstrated that application of the novel APC to SoC products reduced the 3σ of the thinning amount by 60.0%.
  • Keywords
    chemical mechanical polishing; system-on-chip; APC products; Cu-CMP APC; SoC products; compensation; continuous input; high-mix products; high-speed drift; numerical simulation; polishing rate; standard drift; Metrology; Production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • Filename
    5750222