Advanced FD system for COC reduction and quality improvement by using pad height sensor for CMP process

Author

Sakai, Katsuhisa ; Tsuchiyama, Hirofumi ; Nozue, Masaru ; Masuda, Hiroyuki ; Watanabe, Katsuhide ; Kurosawa, Takashi ; Tabaru, Tetsuya

Author_Institution

Renesas Electron. Corp., Hitachinaka, Japan

fYear

2010

fDate

18-20 Oct. 2010

Firstpage

1

Lastpage

4

Abstract

We present an advanced FD system that reduces cost of consumables (COC) and improves quality of Cu-CMP process. By applying a pad height sensor, the lifetime of the polishing pad is precisely extracted. This changes the pad replacement maintenance from time-based to wear-based, resulting in 10% longer pad lifetime. In addition, by monitoring these electric currents of both the polishing head and the polishing table, the pad lifetime is extended up to 10% from wear-based. Then the lifetime is totally 20% improved from the current maintenance period. The pad height sensor also provides the cutting rate of the pad that can predict an unexpected drop in quality due to micro scratches.

Keywords

chemical mechanical polishing; maintenance engineering; quality management; COC reduction; Cu-CMP process; advanced FD system; cost of consumables; electric currents; pad height sensor; pad lifetime; pad replacement maintenance; polishing head; polishing pad; polishing table; quality improvement; Biomedical monitoring; Monitoring;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing (ISSM), 2010 International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-1-4577-0392-8

Electronic_ISBN

1523-553X

Type

conf

Filename

5750230