DocumentCode
1753964
Title
Optimizing return on inspection trough defectivity smart sampling
Author
Sahnoun, Mhamed ; Vialletelle, Philippe ; Bassetto, Samuel ; Bastoini, Soidri ; Tollenaere, Michel
Author_Institution
G-SCOP, INP Grenoble, Grenoble, France
fYear
2010
fDate
18-20 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
In this paper we describe the use of an index to continuously monitor the risk of producing defective parts in a semiconductor production line. This index is used by product inspection policy to select the best lot to be controlled in order to decrease uncertainty on production tool´s health. The approach was tested on data straight from STMicroelectronics Crolles300 production line. We propose to evaluate the efficiency of the inspection policy based on the percentage of wafers inspected unnecessarily from the total number of inspected wafers.
Keywords
inspection; sampling methods; semiconductor device manufacture; semiconductor industry; STMicroelectronics Crolles300; defective parts; product inspection policy; return optimization; risk index; semiconductor production line; smart sampling; wafer; Manufacturing; Robots;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-1-4577-0392-8
Electronic_ISBN
1523-553X
Type
conf
Filename
5750233
Link To Document