Title :
Stress-based inspection system for detecting microcracks on CMP surfaces
Author :
Sakai, Kazufumi ; Yamaguchi, Shinsuke ; Nishio, Naoharu ; Nonaka, Kazuhiro
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Saga, Japan
Abstract :
Microscratches and microcracks generated by chemical mechanical polishing (CMP) show a photoelasticity effect under stress applied by a piezoactuator. The polarization and intensity of the light scattered from microcracks are found to change. On the basis of the abovementioned effect, microcracks formed on a 200-mm wafer subjected to CMP are inspected, and the detected microcracks are studied by SEM and AFM.
Keywords :
atomic force microscopy; chemical mechanical polishing; inspection; microcracks; scanning electron microscopy; AFM; CMP surfaces; SEM; chemical mechanical polishing; microcracks; microscratches; piezoactuator; stress-based inspection system; Artificial neural networks; ISO standards; Image resolution; Nonhomogeneous media; Piezoelectric polarization; Stress; Surface treatment;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
