Optimization of test parameters for the thermal resistance

Thermal resistance called Rth is very important characteristics of power MOSFETs in terms of setting the heat free. ΔVF method has been generally applied on Rth measurement of power MOSFETs. It is difficult, however, to reject inferior products with high accuracy that have local void area in a soldering by only using ΔVF method. In this paper we succeeded in finding the accurate test parameter of ΔVF referring to die-bonding quality.