Title :
3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron
Author_Institution :
Fermi Nat. Accel. Lab., Batavia, IL, USA
Abstract :
Presents a collection of slides covering the following topics: 3D IC multiproject fabrication; high energy physics; circuit bonding; wafer thinning; TSV; radiation detector; CMOS; wafer bonding; and SOI process.
Keywords :
nuclear electronics; particle detectors; silicon-on-insulator; three-dimensional integrated circuits; wafer bonding; 3D IC multiproject fabrication; CMOS; SOI process; TSV; circuit bonding; high energy physics; radiation detector; wafer bonding; wafer thinning; Bonding; Communities; Conferences; Detectors; Three dimensional displays; USA Councils;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751419
