Title :
3D ICs and pixel sensors: The Italian VIPIX project and the European AIDA WP3 project
Author_Institution :
INFN, Univ. of Bergamo, Bergamo, Italy
Abstract :
Presents a collection of slides covering the following topics: 3D integrated circuits; pixel sensors; Tezzaron vertical integration technology; microelectronics; and interconnection technology.
Keywords :
integrated circuit interconnections; three-dimensional integrated circuits; 3D integrated circuits; Tezzaron vertical integration technology; interconnection technology; microelectronics; pixel sensors; Active pixel sensors; CMOS integrated circuits; Detectors; Pixel; Three dimensional displays;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751420
