Title :
3D motivations for high energy physics
Abstract :
A collection of slides from the author´s conference presentation is given. The following topics are discussed: 3D IC; high energy physics; hybrid pixel community; imaging device; and MAPS community.
Keywords :
image sensors; nuclear electronics; three-dimensional integrated circuits; 3D IC; 3D motivation; 3D sensor; MAPS community; high energy physics; hybrid pixel community; imaging device; CMOS integrated circuits; Collaboration; Couplings; Pipelines; Pixel; Power demand; Stacking;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751421
