3D R&D technology for the future voyage in Japan

Author

Inagaki, K.

Author_Institution

Assoc. of Super-Adv. Electron. Technol. (ASET), Kokubunji, Japan

fYear

2010

fDate

16-18 Nov. 2010

Firstpage

1

Lastpage

42

Abstract

Present a collection of slides covering the following topics: 3D R&D technology for the future voyage in Japan; Moore´s law limitation and possible technology solutiuons; 3DIC (dream chip) application fields: healthcare and biology, futuristic robots, advanced consumer electronics, and laptop supercomputers; communication; ubiquitous computing, autopilot for cars; capsule for inspection by CCD or CMOS camera; capsule for inspection, medication & micro operation; retinal prosthesis with 3D staked retinal prosthesis chip; structure of the human retina and 3D stacked retinal prosthesis chip; photograph of fabricated retinal prosthesis module; waveform of recorded electrical evoked potential by using Pt-b stimulus electrode; 3DIC application: automotive, sensor network, ubiquitous platform, ubiquitous platform using μ-chip, for a sustainable society; ASET dream chip project; high frame-rate image sensor; high-bandwidth memory; 3D reconfigurable device (flex chip); RF MEMS device; enabling technology: process technology, design environment, interposer technology, contact/contactless wafer probing & burn-in, and cooling and stacking/bonding; oral and poster list of ASET members; industrial structure- future; and mandatory to establish a new business scheme.

Keywords

CCD image sensors; CMOS image sensors; cochlear implants; cooling; eye; health care; micromechanical devices; robots; stacking; telecommunication; three-dimensional integrated circuits; μ-chip; 3D R&D technology; 3D reconfigurable device; 3D staked retinal prosthesis chip; 3DIC application fields; ASET dream chip project; ASET members; CCD camera; CMOS camera; Moore law limitation; Pt-b stimulus electrode; RF MEMS device; advanced consumer electronics; automotive; biology; bonding; communication; contact wafer probing; contactless wafer probing; cooling; design environment; dream chip; flex chip; futuristic robots; healthcare; high frame-rate image sensor; high-bandwidth memory; human retina; interposer technology; laptop supercomputers; recorded electrical evoked potential; retinal prosthesis; retinal prosthesis module; sensor network; stacking; ubiquitous computing; ubiquitous platform; Automobiles; Biology; Industries; Medical services; Robot sensing systems; Service robots; Three dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2010 IEEE International

Conference_Location

Munich

Print_ISBN

978-1-4577-0526-7

Type

conf

DOI

10.1109/3DIC.2010.5751426

Filename

5751426