• DocumentCode
    1754177
  • Title

    Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis

  • Author

    Zinck, Christophe

  • Author_Institution
    Yole Développement France
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Christophe joined Yole Développement after several positions in the wafer fab and packaging environments of CEA-Leti, STMicroelectronics and then TriQuint Semiconductor, where he has developed Wafer Level packaging technology and flipchip technology for SAW duplexers. He is now project manager at Yole for Advance Packaging, WLP & 3D system Integration and RF devices.
  • Keywords
    Conferences; Nanoscale devices; Packaging; Radio frequency; System-on-a-chip; Three dimensional displays; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich, Germany
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751427
  • Filename
    5751427
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754177