Title :
Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis
Author :
Zinck, Christophe
Author_Institution :
Yole Développement France
Abstract :
Christophe joined Yole Développement after several positions in the wafer fab and packaging environments of CEA-Leti, STMicroelectronics and then TriQuint Semiconductor, where he has developed Wafer Level packaging technology and flipchip technology for SAW duplexers. He is now project manager at Yole for Advance Packaging, WLP & 3D system Integration and RF devices.
Keywords :
Conferences; Nanoscale devices; Packaging; Radio frequency; System-on-a-chip; Three dimensional displays; Very large scale integration;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich, Germany
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751427
