Title :
Integration of multi physics modeling of 3D stacks into modern 3D data structures
Author :
Schneider, Peter ; Heinig, Andy ; Fischbach, Robert ; Lienig, Jens ; Reitz, Sven ; Stolle, Jörn ; Wilde, Andreas
Author_Institution :
Design Autom. Div., Fraunhofer IIS, Dresden, Germany
Abstract :
This paper deals with the concept of how to integrate results of multi physics investigation of 3D stacks into modern comprehensive 3D data structures. Beside a description of modern 3D data structures and methods for floorplanning and Place&Route, approaches for multi physics modeling are introduced. The extension of the layout optimization process by multi physics modeling is investigated. Finally, we conclude with a summary of the future needs for an improved interoperability.
Keywords :
circuit layout; circuit layout CAD; integrated circuit layout; 3D data structure; 3D stack; floorplanning; interoperability; layout optimization; multiphysics modeling; Analytical models; Data structures; Layout; Optimization; Physics; Solid modeling; Three dimensional displays; 3D IC; 3D data structures; Floorplanning; Place&Route; multi physics modeling;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751474
