Title :
The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform
Author :
Stamatiadis, C. ; Stampoulidis, L. ; Vyrsokinos, K. ; Lazarou, I. ; Zimmermann, L. ; Voigt, K. ; Moerl, L. ; Kreissl, J. ; Sedighi, B. ; Sheng, Z. ; De Heyn, P. ; Van Thourhout, D. ; Karl, M. ; Wahlbrink, T. ; Bolten, J. ; Leinse, A. ; Heidemann, R. ; Gom
Author_Institution :
Photonics Commun. Res. Lab., Nat. Tech. Univ. of Athens, Athens, Greece
Abstract :
BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.
Keywords :
elemental semiconductors; flip-chip devices; integrated optics; network routing; silicon; silicon-on-insulator; ICT-BOOM project; SOI nanowire boards; all-optical wavelength conversion; flip-chip bonding; heterogeneous wafer scale fabrication; label processing; photonic integration concept; photonic routing; second generation; silicon-on-insulator hybrid platform; Driver circuits; Optical filters; Optical waveguides; Photodetectors; Photonics; Semiconductor optical amplifiers; Silicon;
Conference_Titel :
Optical Network Design and Modeling (ONDM), 2011 15th International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4244-9596-2
Electronic_ISBN :
978-3-901882-42-5
