DocumentCode :
1754433
Title :
Terabit/Sec VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC
Author :
Doany, F.E. ; Lee, Byeong ; Kuchta, D.M. ; Rylyakov, A.V. ; Baks, Christian ; Jahnes, Christopher ; Libsch, Frank ; Schow, C.L.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
31
Issue :
4
fYear :
2013
fDate :
Feb.15, 2013
Firstpage :
672
Lastpage :
680
Abstract :
We report here on the design, fabrication and characterization of 48-channel parallel optical transceivers demonstrating terabit/sec data transfer rate. The 0.48 Tb/s transmit plus 0.48 Tb/s receive throughput was achieved using a second-generation single-chip holey CMOS transceiver IC. In addition to 24 receiver (RX) and 24 laser diode driver circuits, the 5.2 mm × 5.8 mm single CMOS chip incorporates 48 through-substrate optical vias (holes), one for each transmitter (TX) and RX channel. A complete holey Optochip is formed following direct flip-chip attachment of 24-channel 850-nm VCSEL and PD arrays. The 48 optical vias enable optical access to the 24 VCSELs and 24 PDs. The holey Optochip concept provides a dense chip-scale package which is fully compatible with industry-standard top emitting/detecting 850-nm VCSELs/PDs providing optimized high-speed performance through close integration of the optoelectronic (OE) devices with their drive electronics. Furthermore, the optical vias and OE devices are arranged in a 4 × 12 array on 250 μm × 250 μ m pitch to facilitate direct fiber-coupling to a standard 4 × 12 multi-mode fiber array. The Optochips are packaged into complete modules by flip-chip soldering to high-density, high-speed organic carriers. A pluggable connector soldered to the bottom of the carrier provides all module electrical I/O. The 18 mm × 18 mm overall module area is dictated by the 0.8 mm-pitch ball grid array (BGA) of the organic carrier and connector. Fully functional holey Optomodules with 24 TX and 24 RX channels operate up to 20 Gb/s/ch achieving efficiencies (including both TX and RX) of 7.3 pJ/bit. The terabit/sec data rate (480 Gb/s TX + 480 Gb/s RX) is highest reported for single-chip CMOS transceiver modules.
Keywords :
CMOS integrated circuits; ball grid arrays; chip scale packaging; driver circuits; flip-chip devices; holey fibres; integrated optoelectronics; optical fibre couplers; optical fibre fabrication; optical interconnections; optical transceivers; photodiodes; semiconductor laser arrays; soldering; vias; BGA; OE device; PD array; VCSEL; all module electrical I/O; ball grid array; bit rate 0.48 Tbit/s; channel optical module; data transfer rate; dense chip scale package; direct fiber coupling; drive electronics; flip-chip attachment; flip-chip soldering; holey CMOS transceiver IC; holey Optochip; holey optomodule; laser diode driver circuit; multimode fiber array; optical access; optical vias; optoelectronics; organic carrier; parallel optical transceiver; pluggable connector soldering; receiver; receiving channel; size 0.8 mm; size 18 mm; size 250 mum; size 5.2 mm; size 5.8 mm; size 850 nm; throughput; transmitting channel; vertical cavity surface emitting laser; Connectors; High speed optical techniques; Integrated optics; Optical fibers; Optical receivers; Optical transmitters; CMOS analog integrated circuits; optical communication; optical interconnections; optical receivers; optical transmitters; optoelectronic devices; photodiodes; semiconductor laser arrays;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/JLT.2012.2217938
Filename :
6307806
Link To Document :
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