DocumentCode :
1754444
Title :
Post-Silicon Estimation of Spatiotemporal Temperature Variations Using MIMO Thermal Filters
Author :
Jaeha Kung ; Wen Yueh ; Yalamanchili, Sudhakar ; Mukhopadhyay, Saibal
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
5
Issue :
5
fYear :
2015
fDate :
42125
Firstpage :
650
Lastpage :
660
Abstract :
This paper experimentally demonstrates a methodology for proactive estimation of spatiotemporal variations in junction temperature of a silicon chip using multi-input multi-output (MIMO) thermal filters. The presented approach performs on-chip measurements to estimate the relations between power and temperature variations in the frequency domain to construct a MIMO thermal filter. The extracted filter is then used to predict spatiotemporal temperature variations from a known power pattern, even for locations without temperature sensors. The accuracy of the proposed approach is verified through a thermal emulator designed in 130-nm CMOS technology with on-chip digitally controllable power (heat) generators and temperature sensors. Using the proposed MIMO thermal filter, spatiotemporal temperature variations are accurately estimated with small error bound even at locations with no temperature sensors.
Keywords :
CMOS integrated circuits; elemental semiconductors; estimation theory; filters; frequency-domain analysis; silicon; temperature sensors; CMOS technology; MIMO thermal filter; Si; frequency domain analysis; junction temperature; multiinput multioutput thermal filter; on-chip digitally controllable power-heat generator; on-chip measurement; post-silicon estimation; proactive estimation; silicon chip; size 130 nm; spatiotemporal temperature variation; temperature sensor; thermal emulator design; Estimation; Heating; MIMO; Temperature measurement; Temperature sensors; Multi-input multi-output (MIMO) thermal filter; proactive thermal management; spatiotemporal temperature variations; spatiotemporal temperature variations.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2417113
Filename :
7095569
Link To Document :
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