• DocumentCode
    1754806
  • Title

    Reduced-Loss Ink-Jet Printed Flexible CPW With Copper Coating

  • Author

    Pingye Xu ; Hamilton, Michael C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA
  • Volume
    23
  • Issue
    4
  • fYear
    2013
  • fDate
    41365
  • Firstpage
    178
  • Lastpage
    180
  • Abstract
    Electroplating copper onto ink-jet printed silver coplanar waveguide (CPW) significantly reduces the insertion loss and can improve return loss. The structures are fabricated on flexible polyimide substrates using ink-jet printing and low-temperature curing. Copper-coated silver CPW exhibits good adhesion and flexibility and the RF and microwave performance is minimally affected by bending.
  • Keywords
    coplanar waveguides; curing; electroplating; ink jet printing; copper coating; electroplating copper; low-temperature curing; reduced-loss ink-jet printed flexible CPW; silver coplanar waveguide; Conductivity; Coplanar waveguides; Copper; Current density; Loss measurement; Silver; Substrates; Coplanar waveguide (CPW); copper electroplating; flexible printed circuits; ink-jet printing;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2013.2248704
  • Filename
    6477180
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754806