DocumentCode
1754891
Title
Supply Noise and Impedance of On-Chip Power Distribution Networks in ICs With Nonuniform Power Consumption and Interblock Decoupling Capacitors
Author
Rius, Josep
Author_Institution
Dept. of Electron. Eng., Univ. Politec. de Catalunya, Barcelona, Spain
Volume
23
Issue
6
fYear
2015
fDate
42156
Firstpage
993
Lastpage
1004
Abstract
An RLC model for on-chip power distribution networks (PDN) is presented for array and wire-bonded integrated circuits including interblock decoupling capacitors and C4 impedances. From the model, the supply noise produced by switching blocks as well as the impedance to ac ground as seen from any point of the circuit are calculated as a function of frequency and PDN parameters. The proposed method to perform such calculation allows optimizing relevant PDN design parameters, such as number, size, and location of supply/ground pads and location of interblock decoupling capacitors, and width and pitch of metal tracks. The PDN model and impedance calculations are validated by comparing their results with SPICE simulations, giving a maximum error of less than 1%.
Keywords
RLC circuits; distribution networks; electric impedance; integrated circuit modelling; integrated circuit noise; lead bonding; power supply circuits; C4 impedance; RLC model; SPICE simulation; interblock decoupling capacitors; metal track pitch; metal track width; nonuniform power consumption; on-chip PDN; power distribution networks; supply noise; wire-bonded integrated circuit; Capacitance; Capacitors; Impedance; Integrated circuit modeling; Metals; System-on-chip; Integrated circuit (IC) modeling; power distribution networks (PDNs); power supply noise (PSN); power supply noise (PSN).;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2014.2332189
Filename
6851921
Link To Document