ZnO Nanowires Embedded in Epoxy Resin Separating from the Substrate for Wearable Electronics Applications

A novel lift-off method to obtain ZnO nanowires embedded in flexible films for wearable electronics application has been fabricated in this study. Traditional peel-off method using polydimethylsiloxane (PDMS) polymer to transfer ZnO nanowires to flexible films, however, it remains some ZnO nanowires on the original substrate. The novel lift-off strategy will overcome the previous situation and is a candidate for wearable electronics application. For finger bending application, the maximum open-circuit voltage and closed-circuit current density can be obtained about 115 mV and 59 nA/cm², respectively. Moreover, the lift-off fabrication is a promising method for Si substrate recycling usage and for large area fabrication.