Aligning and Soldering Pure-Copper Nanowires for Nanodevice Fabrication

Pure-copper nanowires (NWs) were aligned and soldered without using $\hbox {N}_{2}$ as protection gas in the alignment and soldering processes. Unlike other research works that used segmented NWs for easier wetting and connection, this paper demonstrates soldering pure-copper NWs on microelectrodes using triethanolamine as soldering agent in the high-temperature soldering environment. The results of the electrical conductivity measurement show that the contact resistance between the microelectrodes bridged by NWs was remarkably reduced by the nanosoldering. Moreover, the resistance between two electrodes changed from $\hbox {1.53}! \times! \hbox {10}^{5}$ to 136 $\Omega$ . The methods introduced in this paper are anticipated to be useful to nanodevice fabrication. $\hfill$ [2012-0164]