DocumentCode :
1756974
Title :
Parameter Extraction Procedure for a Physics-Based Power SiC Schottky Diode Model
Author :
Ruiyun Fu ; Grekov, Alexander E. ; Kang Peng ; Santi, Enrico
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
Volume :
50
Issue :
5
fYear :
2014
fDate :
Sept.-Oct. 2014
Firstpage :
3558
Lastpage :
3568
Abstract :
A detailed parameter extraction procedure for a simple physics-based power silicon carbide (SiC) Schottky diode model is presented. The developed procedure includes the extraction of carrier concentration, active area, and thickness of the drift region, which are needed in the power Schottky diode model. The main advantage is that the developed procedure does not require any knowledge of device fabrication, which is usually not available to circuit designers. The only measurements required for the parameter extraction are simple static I-V characterization and C-V measurements. Furthermore, the physics-based SiC Schottky diode model whose parameters are extracted by the proposed procedure includes temperature dependences and is generally applicable to SiC Schottky diodes. The procedure is demonstrated for five Schottky diodes from two different manufacturers having the following ratings: 600 V/50 A, 1.2 kV/3 A, 1.2 kV/7 A, 1.2 kV/20 A, and 600 V/4 A.
Keywords :
Schottky diodes; carrier density; power semiconductor diodes; semiconductor device models; silicon compounds; wide band gap semiconductors; C-V measurements; SiC; active area; carrier concentration; drift region thickness; parameter extraction procedure; physics-based power SiC Schottky diode model; static I-V characterization; temperature dependences; Capacitance-voltage characteristics; Equations; Mathematical model; Parameter extraction; Schottky diodes; Silicon carbide; Temperature measurement; Parameter extraction procedure; Schottky diode; physics-based model; silicon carbide (SiC);
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2014.2304617
Filename :
6732948
Link To Document :
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