• DocumentCode
    1757539
  • Title

    Efficiency Evaluation of the Modular Multilevel Converter Based on Si and SiC Switching Devices for Medium/High-Voltage Applications

  • Author

    Liyao Wu ; Jiangchao Qin ; Saeedifard, Maryam ; Wasynczuk, Oleg ; Shenai, Krishna

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    62
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    286
  • Lastpage
    293
  • Abstract
    The modular multilevel converter (MMC) is the most promising converter topology for medium- and high-power applications. One of the main concerns in the operation of the MMC, particularly for high-power applications, is its efficiency, which should be maximized. Silicon Carbide (SiC)-based devices have the potential to provide significant efficiency improvement compared with silicon devices. However, the possibility and impact of using SiC-based devices instead of silicon devices for high-power conversion have not been thoroughly explored. This paper reports on the results obtained from a detailed study to evaluate the performance of MMCs based on medium-voltage SiC MOSFETs and diodes with hybrid MMCs that employ silicon IGBTs and SiC diodes. The results are based on detailed circuit simulations that use simple physics-based circuit models. The study suggests the potential for significant efficiency gain for MMCs based on SiC power devices.
  • Keywords
    MOSFET; insulated gate bipolar transistors; power convertors; MMC; SiC; high-power applications; high-power conversion; medium-voltage silicon carbide MOSFET; modular multilevel converter; silicon IGBT; silicon carbide diodes; silicon carbide-based device; Insulated gate bipolar transistors; JFETs; MOSFET; Schottky diodes; Silicon; Silicon carbide; Switches; Efficiency; SiC MOSFET; loss analysis; modular multilevel converter (MMC); silicon IGBT; silicon IGBT.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2375875
  • Filename
    6985656