DocumentCode :
1757539
Title :
Efficiency Evaluation of the Modular Multilevel Converter Based on Si and SiC Switching Devices for Medium/High-Voltage Applications
Author :
Liyao Wu ; Jiangchao Qin ; Saeedifard, Maryam ; Wasynczuk, Oleg ; Shenai, Krishna
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
62
Issue :
2
fYear :
2015
fDate :
Feb. 2015
Firstpage :
286
Lastpage :
293
Abstract :
The modular multilevel converter (MMC) is the most promising converter topology for medium- and high-power applications. One of the main concerns in the operation of the MMC, particularly for high-power applications, is its efficiency, which should be maximized. Silicon Carbide (SiC)-based devices have the potential to provide significant efficiency improvement compared with silicon devices. However, the possibility and impact of using SiC-based devices instead of silicon devices for high-power conversion have not been thoroughly explored. This paper reports on the results obtained from a detailed study to evaluate the performance of MMCs based on medium-voltage SiC MOSFETs and diodes with hybrid MMCs that employ silicon IGBTs and SiC diodes. The results are based on detailed circuit simulations that use simple physics-based circuit models. The study suggests the potential for significant efficiency gain for MMCs based on SiC power devices.
Keywords :
MOSFET; insulated gate bipolar transistors; power convertors; MMC; SiC; high-power applications; high-power conversion; medium-voltage silicon carbide MOSFET; modular multilevel converter; silicon IGBT; silicon carbide diodes; silicon carbide-based device; Insulated gate bipolar transistors; JFETs; MOSFET; Schottky diodes; Silicon; Silicon carbide; Switches; Efficiency; SiC MOSFET; loss analysis; modular multilevel converter (MMC); silicon IGBT; silicon IGBT.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2375875
Filename :
6985656
Link To Document :
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