• DocumentCode
    1757933
  • Title

    Temperature coefficient of frequency modeling for CMOS-MEMS bulk mode composite resonators

  • Author

    Siping Wang ; Wen-Chien Chen ; Bahr, Bichoy ; Weileun Fang ; Sheng-Shian Li ; Weinstein, Dana

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • Volume
    62
  • Issue
    6
  • fYear
    2015
  • fDate
    42156
  • Firstpage
    1166
  • Lastpage
    1178
  • Abstract
    CMOS-MEMS resonators, which are promising building blocks for achieving monolithic integration of MEMS structure, can be used for timing and filtering applications, and control circuitry. SiO2 has been used to make MEMS resonators with quality factor Q > 104, but temperature instability remains a major challenge. In this paper, a design that uses an embedded metal block for temperature compensation is proposed and shows sub-ppm temperature stability (-0.21 ppm/K). A comprehensive analytical model is derived and applied to analyze and optimize the temperature coefficient of frequency (TCF) of the CMOS-MEMS composite material resonator. Comparison with finite element method simulation demonstrates good accuracy. The model can also be applied to predict and analyze the TCF of MEMS resonators with arbitrary mode shape, and its integration with simulation packages enables interactive and efficient design process.
  • Keywords
    CMOS integrated circuits; acoustic resonators; bulk acoustic wave devices; composite material interfaces; micromechanical resonators; CMOS-MEMS bulk mode composite material resonators; embedded metal block; frequency modeling; mode shape; simulation packages; subppm temperature stability; temperature coefficient; temperature compensation; Analytical models; Metals; Micromechanical devices; Resonant frequency; Strain; Temperature; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2014.006724
  • Filename
    7119997