DocumentCode :
1757933
Title :
Temperature coefficient of frequency modeling for CMOS-MEMS bulk mode composite resonators
Author :
Siping Wang ; Wen-Chien Chen ; Bahr, Bichoy ; Weileun Fang ; Sheng-Shian Li ; Weinstein, Dana
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume :
62
Issue :
6
fYear :
2015
fDate :
42156
Firstpage :
1166
Lastpage :
1178
Abstract :
CMOS-MEMS resonators, which are promising building blocks for achieving monolithic integration of MEMS structure, can be used for timing and filtering applications, and control circuitry. SiO2 has been used to make MEMS resonators with quality factor Q > 104, but temperature instability remains a major challenge. In this paper, a design that uses an embedded metal block for temperature compensation is proposed and shows sub-ppm temperature stability (-0.21 ppm/K). A comprehensive analytical model is derived and applied to analyze and optimize the temperature coefficient of frequency (TCF) of the CMOS-MEMS composite material resonator. Comparison with finite element method simulation demonstrates good accuracy. The model can also be applied to predict and analyze the TCF of MEMS resonators with arbitrary mode shape, and its integration with simulation packages enables interactive and efficient design process.
Keywords :
CMOS integrated circuits; acoustic resonators; bulk acoustic wave devices; composite material interfaces; micromechanical resonators; CMOS-MEMS bulk mode composite material resonators; embedded metal block; frequency modeling; mode shape; simulation packages; subppm temperature stability; temperature coefficient; temperature compensation; Analytical models; Metals; Micromechanical devices; Resonant frequency; Strain; Temperature; Thermal stability;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.2014.006724
Filename :
7119997
Link To Document :
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