Title :
Lateral Contact Three-State RF MEMS Switch for Ground Wireless Communication by Actuating Rhombic Structures
Author :
Li-Feng Wang ; Lei Han ; Jie-Ying Tang ; Qing-An Huang
Author_Institution :
Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
A laterally actuated three-state RF microelectromechanical systems switch for ground wireless communication applications is proposed, fabricated, and tested. By electrostatically actuating a rhombic beam, the proposed switch can not only realize the off-state to on -state shifting but also provide an additional deep off state. The switch was fabricated by silicon on glass (SOG) bulk silicon micromachining. The 2- μm-thick gold electroplating layers were introduced in the SOG process to enhance the performance of lateral contacts. The off-state and deep- off-state isolations of the prototype switch were measured to be -67.6 dB and - 72.2 dB at 0.9 GHz and -48.3 dB and -53.0 dB at 6 GHz, respectively. The measured insertion loss is -0.13 dB at 0.9 GHz and -0.38 dB at 6 GHz, respectively. The measured actuation voltage is 78 V. The switching-on and switching-off response times are 72 and 64 μs, respectively.
Keywords :
elemental semiconductors; gold; micromachining; microswitches; microwave switches; radiocommunication; silicon; Au; SOG bulk silicon micromachining; actuating rhombic structures; deep off state; electrostatic actuation; frequency 0.9 GHz; frequency 6 GHz; gold electroplating layers; ground wireless communication; lateral contact three-state RF MEMS switch; laterally-actuated three-state RF microelectromechanical systems; loss -0.13 dB; loss -0.38 dB; rhombic beam; silicon-on-glass bulk silicon micromachining; size 2 mum; switching-off response time; switching-on response time; time 64 mus; time 72 mus; voltage 78 V; Contacts; Micromechanical devices; Microswitches; Radio frequency; Silicon; Substrates; Laterally actuated; RF microelectromechanical systems (MEMS) switch; rhombic deformation; three-state;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2012.2228843