DocumentCode :
1758236
Title :
Microfluidic Injector Simulation With FSAW Sensor for 3-D Integration
Author :
Thu Hang Bui ; Tung Bui Duc ; Trinh Chu Duc
Author_Institution :
Delft Inst. for Microelectron. & Submicron Technol., Delft Univ. of Technol., Delft, Netherlands
Volume :
64
Issue :
4
fYear :
2015
fDate :
42095
Firstpage :
849
Lastpage :
856
Abstract :
This paper presents a possible creation of the optimized liquid sensors for the inkjet nozzles. The proposed focused surface acoustic wave (FSAW) device utilizing aluminum nitride (AlN) single crystal as the piezoelectric substrate is based on the pressure variation due to the continuous droplet ejector. The design, specification, and numerical simulation results are described. Comparisons between the output response of the conventional and concentric structures indicate a more efficient operation of the multiple-segment focused interdigital transducer (FIDT) structure. According to the angular spectrum of the plane wave theory, the amplitude field of FIDTs is calculated through that of straight interdigital transducers. The 3-D integrated model of the FSAW device has a number of advantages, such as the enhancement of the surface displacement amplitudes and an easier fabrication. It is able to detect the breakup appearance of the liquid in the droplet formation process. For the piezoelectric substrate AlN, it is compatible with the CMOS fabrication technology, leading to an inexpensive and reliable system. Moreover, for the proposed FIDTs with multiple straight segments, the acoustic energy is more optimized and focused near the center of the inkjet nozzle. The droplet generation process begins at an output voltage of roughly 0.074 V within 0.25 μs, and the background level of the attenuation of both the mechanical and electrical energy.
Keywords :
CMOS integrated circuits; drops; flow sensors; flow simulation; interdigital transducers; jets; microfabrication; microfluidics; microsensors; nozzles; optimisation; piezoelectric transducers; surface acoustic wave sensors; surface acoustic wave transducers; 3D integrated model; CMOS fabrication technology; FSAW device; FSAW sensor; angular spectrum; breakup appearance detection; concentric structure; continuous droplet ejector; conventional structure; droplet formation process; droplet generation process; electrical energy; focused interdigital transducer; focused surface acoustic wave; inkjet nozzle; liquid sensor optimization; mechanical energy; microfluidic injector simulation; multiple segment FIDT structure; numerical simulation; piezoelectric substrate; plane wave theory; pressure variation; surface displacement amplitude; time 0.25 mus; voltage 0.074 V; Ink; Liquids; Substrates; Surface acoustic wave devices; Surface acoustic waves; Surface treatment; Focused interdigital transducer (FIDT) device; level set method; liquid sensor; microfluidic injector; piezoelectric technology; surface acoustic wave (SAW) devices;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2014.2366975
Filename :
7055962
Link To Document :
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