Title :
Patents and High-Speed Datacenter Interconnects
Author_Institution :
IBM T.J. Watson Research Center
Abstract :
This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.
Keywords :
CPU; GPU; I/O; NIC; cache; data center; datacenter; interconnects; network interface card; patents; simulation; topology;
Journal_Title :
Micro, IEEE
