DocumentCode :
1759184
Title :
Flex-to-Rigid (F2R): A Generic Platform for the Fabrication and Assembly of Flexible Sensors for Minimally Invasive Instruments
Author :
Mimoun, B. ; Henneken, Vincent ; van der Horst, Arjen ; Dekker, Ronald
Author_Institution :
Lab. of Electron. Components, Technol., & Mater., Delft Univ. of Technol., Delft, Netherlands
Volume :
13
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
3873
Lastpage :
3882
Abstract :
The flex-to-rigid (F2R) platform allows for the fabrication of miniature and flexible sensor assemblies for minimally invasive medical instruments such as catheters and guidewires. Devices fabricated on silicon wafers are transferred onto polyimide and partially rendered flexible by means of a two-step backside silicon deep reactive ion etching. The flexibility allows for the devices to be folded into, or wrapped around the tip of the instruments. The fabrication of the whole assembly is based on standard integrated circuit manufacturing technologies so that it is possible to scale the devices down to the dimension of the smallest guidewires. Several demonstrations are presented to show the versatility of the F2R technology, and a polyimide-based flexible thermal flow sensor for application at the tip of a 360- μm diameter guidewire is introduced.
Keywords :
assembling; biomedical electronics; biomedical transducers; catheters; elemental semiconductors; flow sensors; integrated circuit manufacture; polymers; sensors; silicon; sputter etching; temperature sensors; F2R platform; Si; assembly; catheter; flex-to-rigid platform; flexible sensor; flexible thermal flow sensor; guidewire; minimally invasive medical instrument; polyimide; silicon wafer; size 360 mum; standard integrated circuit manufacturing technology; two-step backside silicon deep reactive ion etching; Catheters; Fabrication; Instruments; Polyimides; Silicon; Thermal sensors; Flexible structures; medical diagnosis; microassembly; micromachining; thermal flow sensors;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2013.2252613
Filename :
6480781
Link To Document :
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