DocumentCode :
1759675
Title :
Practical Aspects of EIK Technology
Author :
Berry, Dave ; Deng, H. ; Dobbs, Richard ; Horoyski, Peter ; Hyttinen, Mark ; Kingsmill, Andrew ; MacHattie, Ross ; Roitman, Albert ; Sokol, Ed ; Steer, Brian
Author_Institution :
Commun. & Power Ind. Canada Inc., Georgetown, ON, Canada
Volume :
61
Issue :
6
fYear :
2014
fDate :
41791
Firstpage :
1830
Lastpage :
1835
Abstract :
Significant progress in modeling and manufacturing technologies open wide possibilities for performance improvements of millimeter-wave vacuum electron devices. However, many practical aspects should be considered to realize reliable long-life high-power sources. These are: thermal and RF stability, materials and assembly sensitivity to manufacturing, electrical stresses, cathode poisoning prevention, thermal beam effects, and many others. We address the full spectrum of design and manufacturing aspects while developing state-of-the-art extended interaction klystrons (EIKs). EIKs provide unprecedented RF performance and reliability in a compact user-friendly package. This paper discusses EIK design methodology and manufacturing concepts stating self-imposed restrictions and design modifications enhancing power capability, bandwidth, and extending operating frequencies into the terahertz region.
Keywords :
cathodes; electron device manufacture; electronics packaging; integrated circuit reliability; klystrons; millimetre wave devices; thermal stability; EIK technology; RF stability; cathode poisoning prevention; compact user-friendly package; design modifications; electrical stresses; extended interaction klystrons; high-power sources; manufacturing technology; millimeter wave vacuum electron devices; power capability; reliability; self-imposed restrictions; terahertz region; thermal beam effects; thermal stability; Assembly; Cathodes; Cavity resonators; Optical beams; Optics; Radio frequency; Stress; Dispenser cathode; electron devices; extended interaction klystron (EIK); millimeter wave; terahertz (THz); terahertz (THz).;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2302741
Filename :
6734705
Link To Document :
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