DocumentCode
1760068
Title
Conformal Phosphor Distribution for White Lighting Emitting Diode Packaging by Conventional Dispensing Coating Method With Structure Control
Author
Huai Zheng ; Jinlong Ma ; Xiaobing Luo
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Volume
3
Issue
3
fYear
2013
fDate
41334
Firstpage
417
Lastpage
421
Abstract
Conformal phosphor distribution is a well known way to improve optical performance for white light emitting diode (LED) packaging. However, it is difficult to be realized by mature and cheap dispensing coating methods. In this paper, with consideration given to the effect of boundary constraint on liquid wetting morphology, a method to achieve phosphor conformal distribution is presented by conventional dispensing coating with controlling the slanting angle of reflector cups. The numerical simulations and experiments on phosphor dispensed into reflector cups with different slanting angles are conducted. The results show that uniform phosphor distribution can be obtained when the slanting angle is the same as the contact angle between the phosphor slurry and the reflector cup side wall. The rule can be used to guide the design of the reflector cup and a simple change of reflector cup can realize phosphor conformal coating for white LEDs by the low cost traditional dispensing coating process.
Keywords
contact angle; crystal morphology; light emitting diodes; numerical analysis; phosphors; protective coatings; semiconductor device packaging; slurries; wetting; LED packaging; boundary constraint; conformal phosphor distribution; contact angle; conventional dispensing coating method; liquid wetting morphology; numerical simulations; optical performance; phosphor slurry; reflector cup side wall; slanting angle control; structure control; uniform phosphor distribution; white lighting emitting diode packaging; Coatings; Geometry; Light emitting diodes; Liquids; Packaging; Phosphors; Slurries; Conformal coating; light emitting diodes (LEDs); phosphor;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2227480
Filename
6384721
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