• DocumentCode
    1760937
  • Title

    Assignment of Vertical-Links to Routers in Vertically-Partially-Connected 3-D-NoCs

  • Author

    Foroutan, Sahar ; Sheibanyrad, Abbas ; Petrot, Frederic

  • Author_Institution
    INPG, TIMA, UJF, Grenoble, France
  • Volume
    33
  • Issue
    8
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    1208
  • Lastpage
    1218
  • Abstract
    This paper addresses elevator assignment in vertically-partially-connected 3-D-networks-on-chip (NoCs). Elevators are vertical links between dies. Because of yield issues, Through-Silicon-Via (TSV) cost, and heterogeneity in dimension, topology, and technology of different dies, vertically-partially-connected topologies seem unavoidable in the emerging 3-D-NoCs as opposed to fully-connected topologies. In such partially-connected topologies, as there are fewer elevators than routers, the assignment of elevators to routers becomes a new 3-D-specific optimization problem. An improper assignment can lead to dramatic network performance degradation. This paper proposes an elevator assignment method for best-effort wormhole 3-D-NoCs to improve the average network performance. Experimental results show an improvement of about 90% even compared to a greedy (intrinsically good) initial assignment.
  • Keywords
    network routing; network-on-chip; optimisation; three-dimensional integrated circuits; 3D-specific optimization problem; TSV cost; best-effort wormhole 3D-NoC; dies; elevator assignment method; heterogeneity; through-silicon-via cost; vertical links; vertically-partially-connected 3D-networks-on-chip; vertically-partially-connected topologies; Algorithm design and analysis; Elevators; Hardware; Network topology; Optimization; Routing; Topology; 3D-integration; general assignment problem; heuristic methods; multi-processor system-on-chip; network-on-chip; performance optimization; routing algorithm; taboo search;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2014.2323219
  • Filename
    6856312