• DocumentCode
    1760998
  • Title

    Source/Drain Series Resistance Extraction in HKMG Multifin Bulk FinFET Devices

  • Author

    Ping-Hsun Su ; Yiming Li

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    28
  • Issue
    2
  • fYear
    2015
  • fDate
    42125
  • Firstpage
    193
  • Lastpage
    199
  • Abstract
    Effective extraction of source/drain (S/D) series resistance is a challenging task owing to poor epi-growth and nonuniform distribution of current density in S/D, critical limitation of restrictive design rule, ultra thin contact film, and complicated 3-D fin-type field effect transistor (FinFET) structure. In this paper, we report a test structure for measurement of linear and nonlinear S/D series resistances. This technique enables us to evaluate each component of S/D series resistance resulting from the S/D contact, the S/D epi-growth fin, the S/D extension, and the channel gate, respectively. The S/D series resistance for fins on different layout location of the same diffusion is characterized and modeled by connection with a specified S/D contact on it. Furthermore, the S/D series resistance of each fin can be analytically calculated, respectively, by swapping the S/D bias condition. The proposed test structure and extraction technique provides a robust monitoring tool to diagnose a process weak point of the 16-nm multifin high-k/metal gate bulk FinFET devices.
  • Keywords
    MOSFET; current density; current distribution; electric resistance measurement; high-k dielectric thin films; semiconductor device measurement; semiconductor device testing; semiconductor thin films; HKMG multifin bulk FinFET devices; S/D bias condition; S/D contact; S/D epi-growth fin; channel gate; complicated 3D fin-type field effect transistor structure; diffusion layout location; linear S/D series resistance measurement; multifin high-k-metal gate bulk FinFET devices; nonlinear S/D series resistance measurement; nonuniform current density distribution; restrictive design rule; robust monitoring tool; size 16 nm; source-drain series resistance extraction; test structure; ultra thin contact film; Conductivity; Electrical resistance measurement; FinFETs; Layout; Logic gates; Resistance; Semiconductor device measurement; Bulk FinFET; Bulk fin-type field effect transistor (FinFET); Channel fin doping; Contact size; Epi growth; Explicit model; Extraction; High-κ/metal gate; Measurement; Multi fins; Series resistance; Source/Drain resistance; Test structure; channel fin doping; contact size; epi growth; explicit model; extraction; high-k/metal gate; measurement; multifins; series resistance; source/drain (S/D) resistance; test structure;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2015.2411711
  • Filename
    7057668